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1943 GI/202 4 (1) रजिस्ट्री सं. डी.एल.- 33004/99 REGD. No . D. L. -33004/99
EXTRAORDINARY
PART II —Section 3 —Sub-section ( i)
PUBLISHED BY AUTHORITY
No. 184] NEW DELHI, THURSDAY , MARCH 14, 2024 /PHALGUNA 24, 1945
CG-DL-E-14032024-253006
(1) (2) (3) (4) (5) (6) (7)
MINISTRY OF FINANCE
(Department of Revenue )
NOTIFICATION
New Delhi, the 14 th March, 2024
No. 03/2024 -Customs (ADD)
G.S.R. 197(E).—Whereas in the matter of ‘Printed Circuit Boards (PCB)’ (hereinafter referred to as the
subject goods) falling under tariff heading 8534 0000 of the First Schedule to the Customs Tariff Act , 1975 (51 of
1975) (hereinafter referred to as the Customs Tariff Act), originating in, or exported from China PR and Hong Kong
(hereinafter referred to as the subject countries), and imported into India, the designated authority in its final findings,
vide notification No. 6/16/2022 -DGTR dated the 29th December, 2023 , published in the Gazette of India,
Extraordinary, Part I, Section 1, dated the 29th December, 2023 , has interalia, come to the conclusion that —
(i) the subject goods have been exported to India from the subject countries below normal values;
(ii) the domestic industry has suffered material injury on account of subject imports from subject
countries;
(iii) the material injury has been caused by the dumped imports of subject goods from the subject
countries,
and has recommended imposition of an anti -dumping duty on the imports of subject goods, originating in, or exported
from the subject countries and imported into India, in order to remove injury to the domestic industry.
Now, therefore, in exercise of the p owers conferred by sub -sections (1) and (5) of section 9A of the Customs
Tariff Act read with rules 18 and 20 of the Customs Tariff (Identification, Assessment and Collection of Anti -
dumping Duty on Dumped Articles and for Determination of Injury) Rules, 1 995, the Central Government, after
considering the aforesaid final findings of the designated authority, hereby imposes on the subject goods, the
description of which is specified in column (3) of the Table below, falling under sub heading or tariff item o f the First
Schedule to the Customs Tariff Act as specified in the corresponding entries in column (2), originating in the countries
as specified in the corresponding entries in column (4), exported from the countries as specified in the corresponding
entries in column (5), produced by the producers as specified in the corresponding entries in column (6), and imported
into India, an anti -dumping duty as a percentage of the CIF value of the subject goods as specified in the
corresponding entries in column (7 ), of the said Table, namely: -
TABLE
Sl. No. Sub
Heading or
Tariff Item Description of
Goods Country of
Origin Country
of Export Producer Duty as
% of
CIF
(1) (2) (3) (4) (5) (6) (7)
1 85340000 Printed Circuit
Boards
(PCBs)* China PR Any
country
includin g
China PR Ji’an Shengyi Electronics
Co., Ltd. Nil
Shengyi Electronics Co.,
Ltd.
2 -do- -do- China PR Any
country
including
China PR WUS Printed Circuit
KEPZ (Kunshan) Co.,
Ltd. Nil
WUS Printed Circuit
(Kunshan) Co. Ltd.
WUS Printe d Circuit
(Huangshi) Co., Ltd
3 -do- -do- China PR Any
country
including
China PR Jiangxi Xusheng
Electronics Co., Ltd Nil
4 -do- -do- China PR Any
country
including
China PR Jiangmen Suntak Circuit
Technology Co., Ltd. Nil
Shenzhen Suntak
Multilayer PCB Co., Ltd.
Dalian Suntak
Electronics Co., Ltd.
Dalian Suntak Circuit
Co., Ltd.
Zhuhai Suntak Circuit
Technology Co., Ltd.
5 -do- -do- China PR Any
country
including
China PR Shenzhen Kinwong
Electronic Co., Ltd. 14.78%
Jiangxi Kinwong
Precision Circuit Co.,
Ltd.
Kinwong Electronic
Technology (Longchuan)
Co., Ltd.
Kinwong Electronic
Technology (Zhuhai)
Co., Ltd.
6 -do- -do- China PR Any
country
including
China PR Kin Yip Technology
Electronics (Hui zhou)
Co., Ltd. 75.72%
7 -do- -do- China PR Any
country
including
China PR Shennan Circuits Co.,
Ltd. Nil
Nantong Shennan
Circuits Co., Ltd.
WuXi Shennan Circuits
Co, Ltd.
8 -do- -do- China PR Any
country
including
China PR Kalex Multi -Layer
Circuit Board
(Zhongshan) Ltd. Nil
Merix Printed Circuits
Technology Limited
Guangzhou Termbray
Electronics Technology
Co., Ltd.
Dongguan Meadville
Circuits Co., Ltd.
9 -do- -do- China PR Any
country
including
China PR Jiang xi Longhai Circuit
Technology Co., Ltd. 8.23%
10 -do- -do- China PR Any
country
including
China PR Shenzhen Xinweisai
Electronics Co., Ltd. 14.06%
11 -do- -do- China PR Any
country
including
China PR Kai Ping Elec & Eltek
Company Limited Nil
Kai Ping Elec & Eltek
No.3 Company Limited
12 -do- -do- China PR Any
country
including
China PR Sunshine Global Circuits
Co., Ltd. Nil
Jiu Jiang Sunshine
Circuits Technology Co.,
Ltd.
13 -do- -do- China PR Any
country
including
China PR Inno Ci rcuits Limited 10.14%
14 -do- -do- China PR Any
country
including
China PR Any, Other than S. No. 1
to 13 30%
15 -do- -do- Any country
other than
China PR and
Hong Kong China PR Any 30%
16 -do- -do- Hong Kong Any
country
including
Hong
Kong Any 30%
17 -do- -do- Any country
other than
China PR and
Hong Kong Hong
Kong Any 30%
* The following PCBs are excluded from the scope of the product under consideration: -
i. PCBs with more than 6 layers
ii. PCBs for use in mobile phone applications
iii. Populated pr inted circuit boards of all sizes
iv. PCBs with embedded copper coin
PCBs with embedded copper coin are those PCBs where a metal block is embedded in the middle of the
boards. PCBs with embedded copper coin are mainly used for high powered devices requiring h igh heat
dissipation such as base station amplifier products.
v. Inlay PCB
Inlay PCBs are those where copper, aluminium or other material is inlaid or pressed into the printed circuit
board and serves to dissipate the heat of an electronic component throu gh the printed circuit board to a
bottom side heat sink. The heat -emitting component (heat source) can be connected directly to the metal
inlay. Inlay PCBs are mainly used for high -frequency and high -speed products.
vi. Plated Over Filled Via (POFV) PCB or V ia-in-Pad PCB
POFV products are designed to save space by putting the conductive holes into the SMD (Surface Mounted
Components) pads to be soldered. In order to avoid subsequent soldering paste flowing into the holes and
causing false soldering, the holes need to be filled with resin in advance. Afterwards, the surface is plated
flat so that the surface of the pads with holes is smooth and does not affect the soldering. In POFV PCBs, the
surface is plated with copper. POFV PCBs are mainly used in products with high reliability requirements
like wireless base station products, switches, and routers.
vii. High Density Interconnect (HDI) PCB
HDI PCB are those wherein holes are drilled through laser technology with holes size of ≤ 0.1mm. Drilling
such small hole s needs laser drilling. This is a technology with high processing severity. HDI PCBs are
mainly used for high -density products like mobile phones, switches, and servers.
viii. Rigid -flex PCBs
Rigid -flex PCBs are the combination of flexible circuit boards and rigid circuit boards. Rigid -flex PCBs
accommodate the good properties of both flexible boards and rigid boards. Rigid -flex products are mainly
used in mobile phones, automobiles, industrial control and other applications where there is limited space
for electronic parts installation.
ix. Packaging substrates / IC packaging
Packaging substrates or Integrated circuit (IC) substrate is a baseboard used for packaging of bare
integrated circuit (semi -conductor) chips. They play a crucial role in connecting the P CB to the
semiconductor chip. IC Substrate serves to capture the semiconductor chip, routing to link the chip with the
PCB, and safeguard, support, and reinforce the IC chip, thereby giving i t a thermal dissipation tunnel.
2. The anti -dumping duty imposed un der this notification shall be effective for a period of five years (u nless
revoked, superseded or amended earlier) from the date of publication of this notification in the Official G azette, and
shall be payable in Indian currency.
Explanation. - For the p urposes of this notification, rate of exchange applicable for the purposes of calculation of such
anti-dumping duty shall be the rate which is specified in the notification of the Government of India, Ministry of
Finance (Department of Revenue), issued fro m time to time, in exercise of the powers conferred by section 14 of the
Customs Act, 1962 (52 of 1962), and the relevant date for the determination of the rate of exchange shall be the date
of presentation of the bill of entry under section 46 of the said Act.
[F. No. CBIC -190354/29/2024 -TRU Section -CBEC]
VIKRAM VIJAY WANERE , Under Sec y.
Uploaded by Dte. of Printing at Government of India Press, Ring R oad, Mayapuri, New Delhi -110064
and Published by the Controller of Publications, Delhi -110054.
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