Full Text
REGD. No. D. L.-33004/99
The Gazette of India
CG-DL-E-08032024-252738
EXTRAORDINARY
PART II—Section 3—Sub-section (ii)
PUBLISHED BY AUTHORITY
No. 1062] | NEW DELHI, THURSDAY, MARCH 7, 2024/PHALGUNA 17, 1945
1616 GI/2024
(1)
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THE GAZETTE OF INDIA : EXTRAORDINARY
[PART II—SEC. 3(ii)]
(1) | (2)
3
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
(1) | (2)
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THE GAZETTE OF INDIA: EXTRAORDINARY
[PART II—SEC. 3(ii)]
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
5
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
25% | 35% | 45%
(1) | (2)
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
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THE GAZETTE OF INDIA : EXTRAORDINARY
[PART II—SEC. 3(ii)]
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
25% | 35% | 45%
(1) | (2)
7
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
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THE GAZETTE OF INDIA : EXTRAORDINARY
[PART II—SEC. 3(ii)]
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
25% | 35% | 45%
(1) | (2)
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
7% | 10% | 12%
9
7% | 10% | 12%
2023-24 & 2024-25 | 2025-26 | 2026-27 के बाद
25% | 35% | 45%
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THE GAZETTE OF INDIA: EXTRAORDINARY
[PART II—SEC. 3(ii)]
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MINISTRY OF ELECTRONICS AND INFORMATION TECHNOLOGY
(IPHW DIVISION)
NOTIFICATION
New Delhi, the: 6th March, 2024
Subject: Public Procurement (Preference to Make in India) Order 2017-Notifying CCTV/ Video Surveillance
System for Security in furtherance of the Order
Reference:
(i) Department for Promotion of Industry and Internal Trade (DPIIT) Order No. P-45021/2/2017-
B.E.-II dated 15.06.2017, as amended by Orders dated 28.05.2018, 29.05.2019, 04.06.2020 and
16.09.2020
(ii) Ministry of Electronics and Information Technology (MeitY) Electronic Products Notification
No. W-43/4/2019-IPHW-MeitY dated 07.09.2020
S.O. 1119(E).—The Government has issued Public Procurement (Preference to Make in India) Order 2017
vide the Department for Promotion of Industry and Internal Trade (DPIIT) Order No.P-45021/2/2017-B.E.-II dated
15.06.2017, as amended by Orders dated 28.05.2018, 29.05.2019, 04.06.2020 and 16.09.2020, to encourage 'Make in
India' and promote manufacturing and production of goods and services in India with a view to enhancing income and
employment.
2. In furtherance of the Public Procurement (Preference to Make in India) Order 2017 [PPP-MII Order 2017]
notified vide reference cited above, the Ministry of Electronics and Information Technology (MeitY) hereby notifies
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[PART II—SEC. 3(ii)]
that preference shall be provided by all procuring entities to locally manufactured Video Surveillance System for
Security as per the aforesaid Order, as amended from time to time.
3. For the purpose of this notification:
3.1 The definition of Class-I local supplier, Class-II local supplier and Non-local supplier shall be as per
paragraph 2 of the DPIIT PPP-MII Order 2017 No. P-45021/2/2017-PP(BE-II) dated 16.09.2020, as
amended from time to time. The mechanism for calculation of local content is prescribed for each
notified Electronic Product in this notification.
3.2 Paragraph 3A of the DPIIT PPP-MII Order 2017 No. P-45021/2/2017-PP(BE-II) dated 16.09.2020, as
amended from time to time, shall be referred for percentage of procurement for which preference to
domestically manufactured Electronic Products is to be provided (in value terms).
4. Following electronic products of Video Surveillance System are notified under the Public Procurement
(Preference to Make in India) Order 2017:
4.1 Video Surveillance System
Definition:
For the purpose of this Notification, Video Surveillance System is usually a system that inter-alia
includes: (i) Closed Circuit Television (CCTV) Camera (Analog/IP/ Analog Speed Dome/ IP Speed
Dome), (ii) Digital Video Recorder (DVR) / Network Video Recorder (NVR). Some of the applications of
Security and Video Surveillance System are surveillance of Cities, Schools, Banks, Government Offices,
public places, traffic monitoring and home security, etc.
4.2 Mechanism for calculation of local content of CCTV Camera (Analog):
The domestic BOM of CCTV Camera (Analog) would be the sum of the cost of main inputs as specified in
Column 1 of the following table, provided the inputs individually satisfy the value addition requirement specified
in Column 2 of the table:
Sr. No. | Main inputs in BOM / stages for manufacture of CCTV Camera (Analog) | Value addition / local content required for the input to be classified as domestic BOM
(1) | (2)
1.0 | Main PCB* | Domestic PCB Assembly* and testing from imported / domestically manufactured parts and components, including the value of Semiconductors** and excluding the value of bare PCB. However, the weightage of the total value of Main PCB with/without optional boards shall not exceed 10 % of the total BOM of the CCTV Camera (Analog)
(i) | I/O Board (optional) |
(ii) | Infrared (IR) Board (optional) |
(iii) | Control Board (optional) |
2.0 | Bare PCB | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of Bare PCB shall not exceed 5% of the total BOM of the CCTV Camera (Analog)
3.0 | Optics | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of Optics shall not exceed 10% of the total BOM of the CCTV Camera (Analog)
4.0 | In-house R&D # | Domestically/In-house R&D includes scientific research, experimentation, prototyping and testing for development of new products, process, technologies, or solutions using its own resources/expertise or legal contract with R&D unit registered with Department of Scientific and Industrial Research (DSIR) in India. The weightage of this will be calculated based on the percentage of the domestic BOM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
5.0 | In-house Design/IPR # | Domestically/In-house Designing involves the process of design practices, services, or solutions within the organization's own facilities, using its own resources/expertise or legal contract with third party in India. Any patents, trademarks, copyrights, and trade secrets registered under Intellectual Property
13
Rights (IPR) in India in favor of the design for their creations or inventions establishes legal ownership. The weightage of this will be calculated based on the percentage of the domestic BOM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
6.0 | Housing (Plastic /Aluminium/MS) and Camera Mount | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Housing and Camera Mount shall not exceed to 15% of the total BOM of the CCTV Camera (Analog).
7.0 | Connecting Cables & Connectors | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Connecting Cables and Connectors shall not exceed 5% of the total BOM of the CCTV Camera (Analog).
8.0 | Final Assembly and Testing | Domestically assembled / tested meeting Indian Standards as notified from time to time. The weightage of the total value of final assembling and testing shall not exceed 10% of the total BOM of the CCTV Camera.
* It is essential that the Printed Circuit Board Assembly (PCBA) of the parts and components on the bare PCB using the SMT process should mandatorily be done in India.
** This shall be reviewed when the Semiconductor FAB in India is operational.
# The applicant will be eligible to avail the benefit of Sr. No. 4.0 (In-house R&D) & Sr. No. 5.0 (In-house Design/IPR) in respective financial year for calculation of Value Addition/Local Content by meeting the minimum Value Addition/Local Content mentioned in below table for respective financial year.
Financial Year | 2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
Minimum Value Addition/Local Content of (Sr. No. 1) Main PCB and (Sr. No.8) Final Assembly and Testing as -Essential and others as optional | 25% | 35% | 45%
4.3 Mechanism for calculation of local content of CCTV Camera (IP):
The domestic BOM of CCTV Camera (IP) would be the sum of the cost of main inputs as specified in Column 1 of
the following table, provided the inputs individually satisfy the value addition requirement specified in Column 2 of
the table:
Sr. No. | Main inputs in BOM / stages for manufacture of CCTV Camera (IP) | Value addition / local content required for the input to be classified as domestic BOM
1 | 2
1.0 | Main PCB* with Capture and/or Processor Card | Domestic PCB Assembly* and testing from imported / domestically manufactured parts and components, including the value of Semiconductors** and excluding the value of bare PCB. However, the weightage of the total value of Main PCB with/without optional boards shall not exceed 10% of the total BOM of the CCTV Camera (IP)
(i) | Network Interface Card (optional) |
(ii) | Infrared (IR) Board (optional) |
(iii) | I/O Board (optional) |
(iv) | Power over Ethernet (PoE) Card (optional) |
2.0 | Bare PCB | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of Bare PCB shall not exceed 5 % of the total BOM of the CCTV Camera (IP)
3.0 | Optics | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of Optics shall not exceed 10% of the total BOM of the CCTV Camera (IP)
4.0 | In-house R&D # | Domestically/In-house R&D includes scientific research, experimentation,
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THE GAZETTE OF INDIA: EXTRAORDINARY
[PART II—SEC. 3(ii)]
prototyping and testing for development of new products, process, technologies, or solutions using its own resources/expertise or legal contract with R&D unit registered with Department of Scientific and Industrial Research (DSIR) in India. The weightage of this will be calculated based on the percentage of the domestic BOM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
5.0 | In-house Design/IPR # | Domestically/In-house Designing involves the process of design practices, services, or solutions within the organization's own facilities, using its own resources/expertise or legal contract with third party in India. Any patents, trademarks, copyrights, and trade secrets registered under Intellectual Property Rights (IPR) in India in favor of the design for their creations or inventions establishes legal ownership. The weightage of this will be calculated based on the percentage of the domestic BOM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
6.0 | Housing (Plastic / Aluminium / MS) and Camera Mount | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Housing and Camera Mount shall not exceed 15% of the total BOM of the CCTV Camera (IP).
7.0 | Connecting Cables and Connectors | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Connecting Cables and Connectors shall not exceed 5% of the total BOM of the CCTV Camera (IP).
8.0 | Final Assembly and Testing | Domestically assembled / tested meeting Indian Standards as notified from time to time. The weightage of the total value of Final Assembling and Testing shall not exceed 10% of the total BOM of the CCTV Camera (IP)
* It is essential that the Printed Circuit Board Assembly (PCBA) of the parts and components on the bare PCB using the SMT process should mandatorily be done in India.
** This shall be reviewed when the Semiconductor FAB in India is operational.
# The applicant will be eligible to avail the benefit of Sr. No. 4.0 (In-house R&D) & Sr. No. 5.0 (In-house Design/IPR) in respective financial year for calculation of Value Addition/Local Content by meeting the minimum Value Addition/Local Content mentioned in below table for respective financial year.
Financial Year | 2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
Minimum Value Addition/Local Content of (Sr. No. 1.0) Main PCB and (Sr. No. 8.0) Final Assembly and Testing as -Essential and others as optional | 25% | 35% | 45%
4.4 Mechanism for calculation of local content of CCTV Camera (Analog Speed Dome):
The domestic BOM of CCTV Camera (Analog Speed Dome) would be the sum of the costs of main inputs as
specified in Column 1 of the following table, provided the inputs individually satisfy the value addition requirement
specified in Column 2 of the table:
Sr. No. | Main inputs in BOM / stages for manufacture of CCTV Camera (Analog Speed Dome) | Value addition required for the input to be classified as domestic BOM
1 | 2
1.0 | Main Controller Board* | Domestic PCB Assembly* and testing from imported / domestically manufactured parts and components, including the value of Semiconductors** and excluding the value of bare PCB. However, the weightage of the total value of Main Controller Board/Main PCB with/without optional boards shall not exceed 10% of the total BoM of the CCTV Camera (ASD)
(i) | I/O Board (optional) |
(ii) | Infrared (IR) Board (optional) |
2.0 | Bare PCB | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of Bare PCB shall not exceed 5 % of the total
15
BoM of the CCTV Camera (ASD)
3.0 | In-house R&D # | Domestically/In-house R&D includes scientific research, experimentation, prototyping and testing for development of new products, process, technologies, or solutions using its own resources/expertise or legal contract with R&D unit registered with Department of Scientific and Industrial Research (DSIR) in India. The weightage of this will be calculated based on the percentage of the domestic BoM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
4.0 | In-house Design/IPR # | Domestically/In-house Designing involves the process of design practices, services, or solutions within the organization's own facilities, using its own resources/expertise or legal contract with third party in India. Any patents, trademarks, copyrights, and trade secrets registered under Intellectual Property Rights (IPR) in India in favor of the design for their creations or inventions establishes legal ownership. The weightage of this will be calculated based on the percentage of the domestic BoM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
5.0 | Housing (Plastic/ Aluminium/MS) and Camera Mount | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Housing and Camera Mount shall not exceed 5% of the total BoM of the CCTV Camera (ASD).
6.0 | Connecting Cables and Connectors | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Connecting Cables and Connectors shall not exceed 5% of the total BoM of the CCTV Camera (ASD).
7.0 | Motor, Heater & Blower, Zoom Module, Belt, Plastic Mechanism Parts, Glass etc. | Domestically manufactured from imported / domestically manufactured input parts and mechanical components. However, the weightage of the total value of all these parts/components shall not exceed 5% of the total BoM of the CCTV Camera (ASD)
8.0 | Power Adapter | Domestic PCB assembly* and the final assembly and testing from imported / domestically manufactured parts and components, subject to the condition that the value of domestically manufactured parts and components used in the assembly of "Power Adapter" will be minimum 40% (of the total value of parts and components used in the manufacture of "Power Adapter”). However, the weightage of the total value of “Power Adapter" shall not exceed 5% of the total BoM of the CCTV Camera (ASD)
9.0 | Final Assembly and Testing | Domestically assembled / tested meeting Indian Standards as notified from time to time. The weightage of the total value of final assembling and testing shall not exceed 10% of the total BoM of the CCTV Camera (ASD)
* It is essential that the Printed Circuit Board Assembly (PCBA) of the parts and components on the bare PCB using the SMT process should mandatorily be done in India.
** This shall be reviewed when the Semiconductor FAB in India is operational.
# The applicant will be eligible to avail the benefit of Sr. No. 3.0 (In-house R&D) & Sr. No. 4.0 (In-house Design/IPR) in respective financial year for calculation of Value Addition/Local Content by meeting the minimum Value Addition/Local Content mentioned in below table for respective financial year.
Financial Year | 2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
Minimum Value Addition/Local Content of (Sr. No. 1.0) Main PCB and (Sr. No. 9.0) Final Assembly and Testing as -Essential and others as optional | 25% | 35% | 45%
4.5 Mechanism for calculation of local content of CCTV Camera (IP Speed Dome):
The domestic BOM of CCTV Camera (IP Speed Dome) would be the sum of the costs of main inputs as
specified in Column 1 of the following table, provided the inputs individually satisfy the value addition requirement
specified in Column 2 of the table:
Sr. No. | Main inputs in BOM / stages for manufacture of CCTV Camera (IP Speed Dome) | Value addition / local content required for the input to be classified as domestic BOM
1 | 2
1.0 | Main Controller Board* | Domestic PCB Assembly* and testing from imported / domestically manufactured parts and components, including the value of Semiconductors** and excluding the value of bare PCB. However, the weightage of the total value of Main Controller Borad with/without optional boards Shall not exceed 10% of the total BoM of the CCTV Camera (IPSD)
(i) | I/O Board (optional) |
(ii) | Infrared (IR) Board (optional) |
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(iii) | Processor Card (optional) |
(iv) | Network Interface Card (Optional) |
(v) | Power over Ethernet (PoE) Card (optional) |
2.0 | Bare PCB | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of Bare PCB shall not exceed 5% of the total BoM of the CCTV Camera (IPSD)
3.0 | In-house R&D # | Domestically/In-house R&D_includes scientific research, experimentation, prototyping and testing for development of new products, process, technologies, or solutions using its own resources /expertise or legal contract with R&D unit registered with Department of Scientific and Industrial Research (DSIR) in India. The weightage of this will be calculated based on the percentage of the domestic BoM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
4.0 | In-house Design/IPR # | Domestically/In-house Designing involves the process of design practices, services, or solutions within the organization's own facilities, using its own resources/expertise or legal contract with third party in India. Any patents, trademarks, copyrights, and trade secrets registered under Intellectual Property Rights (IPR) in India in favor of the design for their creations or inventions establishes legal ownership. The weightage of this will be calculated based on the percentage of the domestic BoM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
5.0 | Housing (Plastic / Aluminium / MS) and Camera Mount | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Housing and Camera Mount shall not exceed 5% of the total BoM of the CCTV Camera (IPSD).
6.0 | Connecting Cables and Connectors | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Connecting Cables and Connectors shall not exceed 5% of the total BoM of the CCTV Camera (IPSD).
7.0 | Motor, Heater & Blower, Zoom Module, Belt, Plastic Mechanism Parts, Glass etc. | Domestically manufactured from imported / domestically manufactured input parts and mechanical components. However, the weightage of the total value of all these parts/components shall not exceed 5% of the total BoM of the CCTV Camera (IPSD).
8.0 | Power Adapter | Domestic PCB assembly* and the final assembly and testing from imported / domestically manufactured parts and components, subject to the condition that the value of domestically manufactured parts and components used in the
17
assembly of "Power Adapter" will be minimum 40% (of the total value of parts and components used in the manufacture of "Power Adapter"). However, the weightage of the total value of "Power Adapter” shall not exceed 5% of the total BoM of the CCTV Camera (IPSD)
9.0 | Final Assembly and Testing | Domestically assembled / tested meeting Indian Standards as notified from time to time. The weightage of the total value of final assembling and testing shall not exceed 10% of the total BoM of the CCTV Camera (IPSD)
* It is essential that the Printed Circuit Board Assembly (PCBA) of the parts and components on the bare PCB using the SMT process should mandatorily be done in India.
** This shall be reviewed when the Semiconductor FAB in India is operational.
# The applicant will be eligible to avail the benefit of Sr. No. 3.0 (In-house R&D) & Sr. No. 4.0 (In-house Design/IPR) in respective financial year for calculation of Value Addition/Local Content by meeting the minimum Value Addition/Local Content mentioned in below table for respective financial year.
Financial Year | 2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
Minimum Value Addition/Local Content of (Sr. No. 1.0) Main PCB and (Sr. No. 9.0) Final Assembly and Testing as -Essential and others as optional | 25% | 35% | 45%
4.6 Mechanism for calculation of local content of DVR/NVR:
The domestic BOM of DVR/NVR would be the sum of the cost of main inputs as specified in Column 1 of the
following table, provided the inputs individually satisfy the value addition requirement specified in Column 2 of
the table:
Sr No. | Main inputs in BOM / stages for manufacture of DVR/NVR | Value addition / local content required for the input to be classified as domestic BOM
1 | 2
1.0 | Main PCB* | Domestic PCB Assembly* and testing from imported / domestically manufactured parts and components, including the value of Semiconductors** and excluding the value of bare PCB. However, the weightage of the total value of Main PCB with/without optional boards shall not exceed 10% of the total BoM of the DVR/NVR.
(i) | Front Panel & LED Board (optional) |
(ii) | I/O Board (optional) |
2.0 | Bare PCB | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of Bare PCB shall not exceed 5 % of the total BoM of the CCTV Camera (DVR/NVR)
3.0 | In-house R&D # | Domestically/In-house R&D includes scientific research, experimentation, prototyping and testing for development of new products, process, technologies, or solutions using its own resources/expertise or legal contract with R&D unit registered with Department of Scientific and Industrial Research (DSIR) in India. The weightage of this will be calculated based on the percentage of the domestic BOM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
4.0 | In-house Design/IPR # | Domestically/In-house Designing involves the process of design practices, services, or solutions within the organization's own facilities, using its own resources/expertise or legal contract with third party in India. Any patents, trademarks, copyrights, and trade secrets registered under Intellectual Property
18
THE GAZETTE OF INDIA : EXTRAORDINARY
[PART II—SEC. 3(ii)]
Rights (IPR) in India in favor of the design for their creations or inventions establishes legal ownership. The weightage of this will be calculated based on the percentage of the domestic BOM in respective Financial Year as mentioned in below table.:
2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
7% | 10% | 12%
5.0 | Housing (Plastic / Aluminium / MS) and Camera Mount | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Housing and Camera Mount shall not exceed 5% of the total BoM of the DVR/NVR.
6.0 | Connecting Cables, Connectors and USB Mouse | Domestically manufactured from domestically manufactured inputs. The weightage of the total value of inputs for Connecting Cables, Connectors and USB Mouse shall not exceed 5% of the total BoM of the DVR/NVR.
7.0 | Remote Control | Domestic assembly* and testing from imported / domestically manufactured parts and components subject to the condition that the value of domestically manufactured parts and components used in the assembly of "Remote Control" will be minimum 20% (of the total value of the parts and components used in the manufacture of "Remote Control") in Year 2, which will increase to minimum 30%, 40% and 50% in Financial Years 2025-26, 2026-27 and 2027-28 onwards respectively.
8.0 | Power Adapter | Domestic PCB assembly* and the final assembly and testing from imported / domestically manufactured parts and components, subject to the condition that the value of domestically manufactured parts and components used in the assembly of "Power Adapter" will be minimum 40% (of the total value of parts and components used in the manufacture of "Power Adapter"). However, the weightage of the total value of "Power Adapter" shall not exceed 5% of the total BoM of the DVR/NVR.
9.0 | Final Assembly and Testing | Domestically assembled/tested meeting Indian Standards as notified from time to time. The weightage of the total value of final assembling and testing shall not exceed 10% of the total BOM of the DVR/NVR.
* It is essential that the Printed Circuit Board Assembly (PCBA) of the parts and components on the bare PCB using the SMT process should mandatorily be done in India.
** This shall be reviewed when the Semiconductor FAB in India is operational.
# The applicant will be eligible to avail the benefit of Sr. No. 4.0 (In-house R&D) & Sr. No. 5.0 (In-house Design/IPR) in respective financial year for calculation of Value Addition/Local Content by meeting the minimum Value Addition/Local Content mentioned in below table for respective financial year.
Financial Year | 2023-24 & 2024-25 | 2025-26 | 2026-27 onwards
Minimum Value Addition/Local Content of (Sr. No. 1.0) Main PCB and (Sr. No. 9.0) Final Assembly and Testing as -Essential and others as optional | 25% | 35% | 45%
5. The surveillance devices i.e., CCTV Cameras (Analog/ IP/ Analog Speed Dome/ IP Speed Dome) should comply
with the Essential Requirements (ERs) for security prescribed by MeitY to ensure the security of the VSS / CCTV
systems, as per the Appendix 'A', as amended from time to time. The security testing report for CCTV/VSS to be
issued by Standardisation Testing and Quality Certification (STQC) Laboratory or any other agency notified by MeitY
from time to time. The validity of the test report issued by STQC Lab will be three years from the date of issue of the
report. These Essential Requirements (ERs) for security of CCTV Cameras/VSS system will be enforced after 3
months from the date of issuance of this Notification. The security norms for the DVR and NVR will be notified
subsequently.
6. The notification will come into effect after 3 months from the date of issuance of this Notification. This
Notification shall remain valid till the revised Notification is issued. The Year 1 for the purpose of this notification
would be upto 31.03.2025.
7. No Electronic Product Notification under the Public Procurement (Preference to Make in India) Order 2017 shall
have retrospective effect.
8. Purchase Preference shall be provided as per the provisions cited in the Public Procurement (Preference to Make in
India) Order 2017 dated 16.09.2020 and, as amended from time to time, for the procurement of aforesaid electronics
products.
9. The notification would also be applicable to all Central Schemes (CS)/ Central Sector Schemes (CSS) for the
procurement of electronic products made by States and local bodies, if project or scheme is fully or partially funded by
Government of India.
19
10. Procedure for calculating local content/ domestic value addition
10.1 Bill of Material sourced from domestic manufacturers (Dom-BOM) may be calculated based on one of the
followings depending on data available:
a) Sum of the costs of all inputs which go into the product (including duties and taxes levied on procurement of
inputs except those for which credit/ set-off can be taken) and which have not been imported directly or
through a domestic trader or an intermediary.
b) Ex-Factory Price of product minus profit after tax minus sum of imported Bill of Material used (directly or
indirectly) as inputs in producing the product (including duties and taxes levied on procurement of inputs
except those for which credit/ set-off can be taken) minus warranty costs.
c) Market price minus post-production freight, insurance and other handling costs minus profit after tax minus
warranty costs minus sum of Imported Bill of Material used as inputs in producing the product (including
duties and taxes levied on procurement of inputs except those for which credit / set-off can be taken) minus
sales and marketing expenses.
10.2 Total Bill of Material (Total BOM) may be calculated based on one of the following depending on data available:
a) Sum of the costs of all inputs which go into the product (including duties and taxes levied on procurement of
inputs except those for which credit / set-off can be taken).
b) Ex-Factory Price of product minus profit after tax, minus warranty costs.
c) Market price minus post-production freight, insurance and other handling costs minus profit after tax, minus
warranty costs minus sales and marketing expenses.
10.3 The percentage of domestic value-addition may be calculated based on information furnished as per the
following formula:
Percentage of local content/ domestic value-addition = [(Dom-BOM) / (Total BOM)]*100
11. Verification of local content/ Domestic Value Addition
11.1. The local supplier at the time of tender, bidding or solicitation shall provide self-certification that the item
offered meets the minimum local content and shall give details of the location(s) at which the local value addition is
made.
11.2. In cases of procurement for a value in excess of Rs.10 crore, the local supplier shall provide a certificate from
the statutory auditor or cost auditor of the company (in the case of companies) or from a practicing cost accountant
or practicing chartered accountant (in respect of suppliers other than companies) giving the percentage of local
content.
11.3. In case a complaint is received by the procuring agency or the concerned Ministry/Department against the
claim of a bidder regarding local content/ domestic value addition in an Electronic Product(s), the same shall be
referred to STQC.
11.4. Any complaint referred to STQC shall be disposed of within 4 weeks. The bidder shall be required to furnish
the necessary documentation in support of the domestic value addition claimed in an Electronic Product(s) to STQC.
If no information is furnished by the bidder, such laboratories may take further necessary action, to establish the
bonafides of the claim. In case of the discrepancies in computation of local content, a certificate from the statutory
auditor or cost auditor of the company (in the case of companies) or from a practicing cost accountant or practicing
chartered accountant (in respect of suppliers other than companies) for calculating the percentage of local content
will supersede over the self-declaration certificate.
11.5. A complaint fee of Rs.2 Lakh or 1% of the value of the domestically manufactured Electronic Products being
procured (subject to a maximum of Rs. 5 Lakh), whichever is higher, to be paid by Demand Draft to be deposited
with STQC. In case, the complaint is found to be incorrect, the complaint fee shall be forfeited. In case, the
complaint is upheld and found to be substantially correct, deposited fee of the complainant would be refunded
without any interest.
11.6. False declarations will be in breach of the Code of Integrity under Rule 175(1)(i)(h) of the General Financial
Rules (GFR) for which a bidder or its successors can be debarred as per Rule 151 (iii) of the General Financial Rules
along with such other provisions of bidding, debarment by a single Ministry/Department and revocation of orders as
per the Department of Expenditure O.M-No. F.1/20/2018-PPD dated 2nd Nov, 2021 may be permissible under law
amended from time to time.
12. MeitY shall be the Nodal Ministry to monitor the implementation of the Electronic Products notifications. In
case of any dispute/clarifications against the decision given by STQC, a committee is constituted with the following
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THE GAZETTE OF INDIA : EXTRAORDINARY
[PART II—SEC. 3(ii)]
compositions for verification/vetting the complaints, independent verification of self-declarations and
auditor's/accountant's certificates on random basis, restrictive and discriminating terms and conditions against the
domestic manufactures of Electronics Products(s): -
i) | Group Coordinator/Scientist- 'G' (IPHW) | - Chairperson
ii) | Scientist-'G'/Scientist-'F' from STQC | - Member
iii) | Scientist- 'E' or above from Cert-In/Cyber Division | - Member
vi) | Any other member(s) as co-opted by the Chairperson | - Member
v) | Representative from IPHW Division | - Member Secretary
13. In case of a question whether an item being procured is an Electronic Product(s) to be covered under the
Public Procurement (Preference to Make in India) Order 2017, the matter would be referred to the Ministry of
Electronics and Information Technology for clarification.
[F. No. W-43/11/2021-IPHW]
ASHA NANGIA, Group Coordinator & Scientist 'G'
Appendix 'A'
Essential Requirement(s) for Security of CCTV
Securing a CCTV (Closed-Circuit Television) system is crucial to protect sensitive information and ensure the system
operates effectively. Key areas of testing include exposed network services, device communication protocols, physical
access to the device's UART, JTAG, SWD, etc., the ability to extract memory and firmware, firmware update process
security and storage and encryption of data. Here are brief requirements for the security of a CCTV system:
1) Physical Security Use tamper-resistant camera enclosures and locking mechanisms to deter physical
tampering.
2) Access Control by Authentication, Role-Based Access Control (RBAC) and regularly review and update
access permissions to reflect personnel changes.
3) Network Security by employing encryption of data transmission
4) Software Security by Regular Updates, Disable Unused Features and Strong Password Policies
5) Penetration Testing: Employ penetration testing to assess the system's resistance to cyberattacks and address
vulnerabilities.
Essential Security Requirements
Sr. No. | Category | Testing Parameter | What to be tested | Documents Required
1) | Hardware Level Security Parameter (supported by software) | 1.1 Verify that application layer debugging interfaces such USB, UART, and other serial variants are disabled or protected by a complex password. | 1. Identification of the availability of debugging interfaces such as USB, UART, and other serial variants through the Datasheet of the SoC being used in the device under test | 1. Datasheet of the SoC being used in the device.
| | | 2. Verification and validation of the ports/interfaces enabled in the production devices and the related access control mechanism for protection of the same as declared in the vendor documentation | 2. Documentation related to ports/interfaces enabled in the production devices and the related access control mechanism for protection of the same.
| | | 3. Testing, in presence of OEM team, to verify the enabling/disabling of all the ports and debugging interfaces such as USB, UART, and other serial variants using their relevant hardware based debuggers and access control mechanisms in case the interface is enabled. | 3. Process flow of the Manufacturing/Provisioning of the device
| | | 4. Process audit of the manufacturing facility to validate the vendor's claim regarding the debugging interfaces which are closed/disabled during provisioning. |
| | | [For instance, through Block connection diagram depicting pin connections between the host microcontroller and its interactions with various sub components/peripherals.] |
| | 1.2 Verify that cryptographic keys and certificates are unique to each individual device. | Identifying all the keys and certificates being used in the device eco-system and verification through: | 1. List of all keys and certificates being used in the device ecosystem
| | | • Testing, in presence of OEM team | 2. Key management life cycle (purpose, generation, storage, destruction/zeroization, validity, key changeover/rotation)
| | | • Code review |
| | | • Process audit of the key-life cycle process |
| | 1.3 Verify that on-chip debugging interfaces such as JTAG or SWD are disabled or that available protection mechanism is enabled and configured appropriately. | 1. Identification of the availability of debugging interfaces such as USB, UART, and other serial variants through the Datasheet of the SoC being used in the device under test | 1. Datasheet of the SoC being used in the device.
| | | 2. Verification and validation of the ports/interfaces enabled in the production devices and the related access control mechanism for protection of the same as declared in the vendor documentation | 2. Documentation related to ports/interfaces enabled in the production devices and the related access control mechanism for protection of the same.
| | | 3. Testing, in presence of OEM team, to verify the enabling/disabling of all the ports and debugging interfaces such as USB, UART, and other serial variants using their relevant hardware based debuggers and access control mechanisms in case the interface is enabled. | 3. Process flow of the Manufacturing/Provisioning of the device
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1.4 Verify that trusted execution is implemented and enabled, if available on the device SoC or CPU. | Identifying whether TEE/SE/TPM is available or not in the device through the SoC datasheet and technical documentation submitted by the vendor. | 1. Datasheet of the SoC being used in the device.
| | | Further assessment is done on the basis of scenarios as applicable to device as defined below: | 2. User manual/Technical specifications of the device
| | | CASE 1: TEE/SE/TPM is not available: No further assessment | 3. Code snippets of the TEE API call, wherever applicable
| | | CASE 2: TEE/SE/TPM is available and enabled: Verification through code-review that crypto functions are called through TEE/SE/TPM APIs. |
| | | CASE 3: TEE/SE/TPM is available but not enabled by the vendor: Termed as non-conformance to the requirement. OEM is required to enable and implement the TEE/SE/TPM. |
| | 1.5 Verify that sensitive data, private keys and certificates are stored securely in a Secure Element, TPM, (Trusted Execution Environment), or protected using strong cryptography. | Identifying all the keys and certificates being used in the device eco-system, sensitive data and their storage mechanism(s); and verification through: | 1. List of all keys and certificates being used in the device ecosystem
| | | • Testing, in presence of OEM team | 2. List of all the sensitive data with their intended usage and secure storage mechanism(s) as implemented along with secure configurations to be enabled in the device.
| | | • Code review | 3. Key management life cycle (purpose, generation, storage, destruction/zeroization, validity, key changeover/rotation) private keys and certificates.
| | | • Process audit of the key-life cycle process |
| | 1.6 Verify the presence of tamper resistance and/or tamper detection features. | Testing, in presence of OEM team, to verify the measures implemented in the device to prevent software and hardware tampering. | 1. Measures available in the device to prevent software tampering.
| | | | 2. Measures available in the device to prevent hardware tampering.
| | 1.7 Verify that any available Intellectual Property protection technologies provided by the chip manufacturer are enabled. | Testing, in presence of OEM team, to verify the enabling of the Intellectual Property protection technologies provided by the chip manufacturer, if available. | 1. Datasheet of the SoC
| | | | 2. Documentation regarding the Intellectual Property protection technologies provided by the chip manufacturer which have been enabled.
| | | | 3. In case, no Intellectual Property protection technologies are being provided by the chip manufacturer, then a declaration stating the same.
| | 1.8 Verify the device validates the boot image signature before loading. | Testing, in presence of OEM team, to verify the following: | 1. Datasheet of the SoC
| | | 1. Device boots up successfully with the documented secure boot process when a valid boot image is provided. | 2.Technical specifications of the device regarding secure boot (should consist of keys involved and their management life cycle*, signature validation process and any other secure mechanisms if implemented.)
| | | 2. Device does not boot up when a tampered boot image (like with missing signature, invalid signature) is provided. |
| | 1.9 Verify usage of cryptographically secure pseudo-random number generator on embedded device (e.g., using chip-provided random number generators). | Verification of the documentation provided by the vendor regarding the random number generators being used in the device. | Documentation regarding the random generators (either hardware based or software based or both) being used in the device with their intended usage.
| | | Verification through code-review that random number generators or related libraries as applicable are being used in the device. | In case, hardware based random number generators are being used, vendors shall submit the following:
| | | | 1. Datasheet of the SoC
| | | | 2. Technical specifications of the device regarding random generators
| | | | In case, software based random number generators are being used, vendors shall provide the libraries being used for the same.
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THE GAZETTE OF INDIA : EXTRAORDINARY
[PART II—SEC. 3(ii)]
2) | Software/Firmware | 2.1 Verify that memory protection controls such as ASLR and DEP are enabled by the embedded/IoT operating system, if applicable. | Testing, in presence of OEM team, to verify the declared memory protection controls available and enabled in the device using command line-based tools/commands or any other open-source tool like DEP, EMET tool. | Declaration of the memory protection controls available and enabled in the device.
| | 2.2 Verify that the firmware apps protect data-in-transit using transport layer security. | 1. Verifying that strong encryption algorithms and secure TLS version is supported by the device to establish secure communication. | Specifications and documentation related to the configurations available in the applications and firmware related to transport layer security.
| | | 2. Verifying that device properly validates the server's TLS certificate to ensure that it is trusted and has not been tampered with. |
| | | 3. Testing for vulnerabilities which can affect the security of TLS connection such as padding oracle attacks, or weak cipher suites. |
| | | 4. Using tools such as Nmap to identify open ports through which device can be accessed leading to unintended data retrieval. |
| | | 5. Verifying that theTLS session(s) are resistant to attemptsof interception and decryption of network traffic using man-in-the-middle attacks using tools like Burpsuite. |
| | 2.3 Verify that the firmware apps validate the digital signature of server connections. | 1. Identifying the scenarios when the device establishes the server connections with the external world and verifying the following: | Document mentioning the use-cases when the device establishes server connections with the external world, with detailed information about the security measures in place while validating the digital signatures of the server connections.
| | | • Security features, related to secure server connections and digital signature validation as implemented like strong cipher suites, secure TLS version, SSL pinning etc. supported by code walkthrough. |
| | | • Proper certificate validation, certificate chain validation and certificate revocation checks are implemented in the device. |
| | | 2. Testing for vulnerabilities which can affect the security of TLS connection such as padding oracle attacks, or weak cipher suites. |
| | | 3. Using tools such as Nmap to identify open ports through which device can be accessed leading to unintended data retrieval. |
| | | 4. Verifying that TLS session(s) are resistant to attemptsof interception and decryption of network traffic using man-in-the-middle attacks using tools like Burpsuite. |
| | 2.4 Verify that any use of banned C functions are replaced with the appropriate safe equivalent functions. | Secure code review [both automated and manual], in presence of OEM team, using a licensed static analysis tool through any of the following approaches: | 1. Firmware binaries for code review.
| | | 1. Visit to the evaluation agency by the vendor with the firmware code and installing the licensed static analysis tool available with the evaluation agency in their systems. [Recommended] | 2. Internal code review reports
| | | 2. Visit to the evaluation agency by the vendor with the firmware code and any licensed static analysis tool available with them and demonstrating the code review activity in the presence of representatives of evaluation agency. |
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3. Giving a remote access of the systems at vendor site to the evaluation agency for installing their licensed static analysis tool available with them. |
| | | 4. Giving a remote access of the systems at vendor site to the evaluation agency containing the firmware code along with the licensed static analysis tool available with the vendors. |
| | 2.5 Verify that each firmware maintains a software bill of materials cataloging third party components, versioning, and published vulnerabilities. | Verification of the submitted list of third-party components by running automated tools like FACT on the firmware. | 1. Documentation for information on software bill of materials, including third-party components and versions.
| | | Identifying vulnerabilities in the third-party component(s) through publically available vulnerability databases. | 2. Organization process and policies for the following:
| | | Verification and validation of the process defined by the vendor for providing regular security updates and patches for the firmware to address any known vulnerabilities in third-party components. | • Addressing and patching any identified vulnerabilities in third-party components.
| | | | • Informing the customers about the security issues or vulnerabilities and providing security updates and patches for the same.
| | | | 3. Configuration management system and related policies for maintaining firmware and third-party binaries, libraries and frameworks along with the patches/fixes issued to the devices.
| | 2.6 Verify all code including third-party binaries, libraries, frameworks are reviewed for hardcoded credentials (backdoors). | Independent secure code review [both automated and manual], using a licensed static analysis tool through any of the following approaches: | 1. Firmware binaries for code review.
| | | 1. Visit to the evaluation agency by the vendor with the firmware code and installing the licensed static analysis tool available with the evaluation agency in their systems. | 2. Internal code review reports
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[Recommended] |
| | | 2. Visit to the evaluation agency by the vendor with the firmware code and any licensed static analysis tool available with them and demonstrating the code review activity in the presence of representatives of evaluation agency. |
| | | 3. Giving a remote access of the systems at vendor site to the evaluation agency for installing their licensed static analysis tool available with them. |
| | | 4. Giving a remote access of the systems at vendor site to the evaluation agency containing the firmware code along with the licensed static analysis tool available with the vendors. |
| | 2.7 Verify that the firmware apps pin the digital signature to a trusted server(s). | 1. Identifying the scenarios when the device establishes the server connections with the external world and verifying the following: | Document mentioning the use-cases when the device establishes server connections with the external world, with detailed information about the security measures in place while validating the digital signatures of the server connections.
| | | • Security features, related to secure server connections and digital signature validation as implemented like strong cipher suites, secure TLS version, SSL pinning etc. supported by code walkthrough. |
| | | • Proper certificate validation, certificate chain validation and certificate revocation checks are implemented in the device. |
| | | 2. Testing for vulnerabilities which can affect the security of TLS connection such as padding oracle attacks, or weak cipher suites. |
| | | 3. Using tools such as Nmap to identify open ports through which device can be accessed leading to unintended data retrieval. |
| | | 4. Verifying that TLS session(s) are resistant to attemptsof interception and decryption of network traffic using man-in-the-middle attacks using tools like Burpsuite. |
| | 2.8 Verify security controls are in place to hinder firmware reverse engineering (e.g.removal of verbose debugging symbols). | Testing, in presence of OEM team, to verify the security controls as provided by the vendor to hinder firmware reverse engineering. | Documentation regarding the security controls in place to hinder firmware reverse engineering.
| | 2.9 Verify that the firmware update process is not vulnerable to time-of-check vs time-of-use attacks. | OEM team, to verify the measures implemented in the device to make it resistant to time-of-check vs.time-of-use attacks. | the device to make it resistant to time-of-check vs. time-of-use attacks.
| | 2.10 Verify the device uses code signing and validates firmware upgrade files before installing. | Testing, in presence of OEM team, to verify the following: | Process of achieving secure firmware upgrade which should consist of keys involved and their management life cycle*, signature validation process and any other secure mechanisms if implemented.
| | | i) Device gets successfully updated with the documented secure upgrade process when a valid update package is provided. |
| | | ii) Device does not boot up when a tampered update package (like with missing signature, invalid signature) is provided. |
| | 2.11 Verify that the device cannot be downgraded to old versions (anti-rollback) of valid firmware. | Testing, in presence of OEM team, to verify that the device cannot be downgraded to old versions (anti-rollback) of valid firmware. | Process of achieving secure firmware upgrade which should consist of keys involved and their management life cycle*, signature validation process and any other secure mechanisms if implemented.
| | 2.12 Verify that firmware can perform automatic firmware updates upon a predefined schedule. | Verification shall be done as per the applicable scenario: | 1. Modes of updates available i.e. automatic, manual or both.
| | | Case 1: Automatic OTA updates are available: A standard operating procedure for issuing automatic updates/upgrades to the in-field devices is required to be submitted by the vendor which can then be evaluated by the evaluation agency as per C20, C21 and C22 security requirement. | 2. Organizational process and policies regarding the issuing of updates to the devices.
| | | Case 2: Automatic OTA updates are not available and vendor provides manual updates: A standard operating procedure for issuing manual updates/upgrades to the in-field devices is required to be submitted by the vendor which can then be evaluated by the evaluation agency as per C20, C21 and C22 security requirement. |
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3) | Secure Process Conformance | 3.1 Verify that wireless communications are mutually authenticated. | Testing, in presence of OEM team, to verify the process of mutual authentication as laid down in the documentation by the vendor. | The documentation regarding the process of mutual authentication as implemented in the device when wireless communications are initiated.
| | | | In case, the device does not support wireless communications, the vendor shall provide a declaration for the same.
| | 3.2 Verify that wireless communications are sent over an encrypted channel. | Identifying all the security mechanisms being used in the communication process verification through: | Documentation regarding the security measures implemented in the device to prevent tampering of the data being sent through wireless mode of communication.
| | | • Testing, in presence of OEM team | In case, the device does not support wireless communications, the vendor shall provide a declaration for the same.
| | | • Code review |
| | | • Process audit of the key-life cycle process |
| | 3.3 Verify that whether trusted sources are being used for sourcing the components of the device i.e. trusted supply chain through a managed Bill of materials for critical hardware components (related to security functions like SoC) is in use. | Bill of materials for critical hardware components (related to security functions like SoC). |
| | 3.4 Supply chain risk identification, assessment, prioritization, and mitigation shall be conducted. Supply chain risk/business continuity planning policy documents, playbooks reflecting how to handle supply chain disruption, post-incident summary documents. | Supply chain risk identification, assessment, prioritization, and mitigation documents. |
| | | Supply chain risk/business continuity planning policy documents, playbooks reflecting how to handle supply chain disruption, post-incident summary documents need to be submitted and demonstrate the same. |
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4) | Security Conformance at product development stage | 4.1 Design and architecture details till the PCBA and SoC level to be provided to aid in counterfeit mitigation and malware detection. | Design and architecture documents till the PCBA and SoC level. |
| | 4.2 Threat mitigation strategies for tainted and counterfeit products shall be implemented as part of product development. | Process and method artifacts need to be submitted and demonstrate the same. |
| | 4.3 One or more up-to-date malware detection tools shall be deployed as part of the code acceptance and development processes. | List of components that have been identified as requiring tracking targets of tainting/counterfeiting, CM tool. |
| | | Quality assurance process need to be submitted and demonstrate the same. |
| | | Malware detection techniques shall be used before final packaging and delivery (e.g., scanning finished products and components for malware using one or more up-to-date malware detection tools). |
| | 4.4 Supply chain risk identification, assessment, prioritization, and mitigation shall be conducted. | Supply chain risk/business continuity planning policy documents, playbooks reflecting how to handle supply chain disruption, post-incident summary documents need to be submitted and demonstrate the same. |
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